✦ LIBER ✦
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
✍ Scribed by S. W. Liang; Hsiang-Yao Hsiao; Chih Chen; Luhua Xu; K. N. Tu; Yi-Shao Lai
- Book ID
- 107455613
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Weight
- 399 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
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