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Computational analysis of the interfacial effect on electromigration in flip chip solder joints

โœ Scribed by Dongchoul Kim

Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
545 KB
Volume
86
Category
Article
ISSN
0167-9317

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The polarity effect of electromigration on the interfacial reactions of micro ball grid array (lBGA) solder joints was studied in terms of microstructural evolution. A dummy lBGA package with the same pair of solder joints was used to obtain reproducible results for a practical application. The lBGA