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Role of abrasives in high selectivity STI CMP slurries

✍ Scribed by R. Manivannan; S. Ramanathan

Book ID
104051969
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
179 KB
Volume
85
Category
Article
ISSN
0167-9317

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✦ Synopsis

In this study chemical mechanical planarization slurries for shallow trench isolation exhibiting high oxide to nitride polish rate selectivity were investigated and it was found that the abrasives play a major role in suppressing the nitride polish rate and enhancing selectivity. When glutamic acid is used as a selectivity enhancing additive, only ceria based slurries exhibit high selectivity while silica based slurries show low selectivity under identical conditions. A mechanism involving active sites on the ceria abrasive and interaction of glutamic acid with the active sites is proposed to explain the role of abrasive in enhancing selectivity.

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