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Resistive-switching behavior and mechanism in copper-nitride thin films prepared by DC magnetron sputtering

✍ Scribed by Zhu, Wei ;Zhang, Xin ;Fu, Xiaoniu ;Zhou, Yongning ;Luo, Shengyun ;Wu, Xiaojing


Book ID
112181087
Publisher
John Wiley and Sons
Year
2012
Tongue
English
Weight
720 KB
Volume
209
Category
Article
ISSN
0031-8965

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## Abstract Copper nitride film prepared by plasma‐immersion ion implantation (PIII) is demonstrated to exhibit reversible resistance variance character. By forming a gradually distributed nitrogen concentration in the Cu‐nitride film, the nitride‐based memory devices show bipolar nature with a low