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Residual stress in thick films

โœ Scribed by P.L. Kirby; A. Owens

Book ID
108361242
Publisher
Elsevier Science
Year
1983
Tongue
English
Weight
370 KB
Volume
14
Category
Article
ISSN
0026-2692

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Effect of deposition processes on residu
Effect of deposition processes on residual stress profiles along the thickness in (Ti,Al)N films
โœ Sheng-Sheng Zhao; Ying Yang; Jia-Bao Li; Jun Gong; Chao Sun ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 815 KB

The effect of deposition processes on the distribution of residual stresses in the thickness of the (Ti,Al)N films prepared by arc ion plating (AIP) was investigated in the present work, which indicates that the stress distribution exhibits a "bell" shape and the maximum compressive stress appears i