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Residual stress and structural characteristics in Ti and Cu sputtered films on glass substrates at different substrate temperatures and film thickness

✍ Scribed by Hadi Savaloni; Ali Taherizadeh; Akbar Zendehnam

Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 348 KB
Volume: 349
Category: Article
ISSN: 0921-4526
DOI: 10.1016/j.physb.2004.01.158

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