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Reliability Evaluation of High Power AlGaN/GaN HEMTs on SiC Substrate

โœ Scribed by Kim, H. ;Tilak, V. ;Green, B.M. ;Smart, J.A. ;Schaff, W.J. ;Shealy, J.R. ;Eastman, L.F.


Publisher
John Wiley and Sons
Year
2001
Tongue
English
Weight
86 KB
Volume
188
Category
Article
ISSN
0031-8965

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โœฆ Synopsis


Subject classification: 73.30.+y; 73.40.Kp; S7.14 Undoped AlGaN/GaN HEMTs grown on SiC substrates have recently demonstrated record output power density of 10.7 W/mm (cw) and total output power of 10 W at 10 GHz (L. F. Eastman, Joint ONR/MURI Review (5/15-16, 2001), CA (USA) [1]). In this paper, we present the results of reliability tests performed on undoped AlGaN/GaN HEMTs on SiC under dc and rf stress conditions. Undoped AlGaN/GaN HEMTs on SiC substrates have been submitted to on-wafer dc and rf stress conditions at a room temperature and the degradation in device performance induced by hot electron and thermal effects have been observed.


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