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Relative figures of merit for chip-to-MCM substrate interconnection methods

✍ Scribed by Shrivastava, U.A.; Valetine, W.; Mahalingam, M.

Book ID: 114560476
Publisher: IEEE
Year: 1993
Tongue: English
Weight: 790 KB
Volume: 16
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.241785

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