Reliability figures of merit for surface-soldered leadless chip carriers compared to lead packages

✍ Scribed by Clech, J.-P.M.; Engelmaier, W.; Kotlowitz, R.W.; Augis, J.A.

• Book ID: 117872636
• Publisher: IEEE
• Year: 1989
• Tongue: English
• Weight: 920 KB
• Volume: 12
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.49001