✦ LIBER ✦
Reliability figures of merit for surface-soldered leadless chip carriers compared to leaded packages : Jean-Paul M. Clech, Werner Engelmaier, Robert W. Kotlowitz and Jacques A. Augis. IEEE Trans. Compon. Hybrids mfg Technol.12(4), 449 (1989)
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 139 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.