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Real time monitoring of the crystallization process during the plasma annealing of amorphous silicon

✍ Scribed by Ohta, Naoki ;Imamura, Takashi ;Shimizu, Hirokazu ;Kobayashi, Tomohiro ;Shirai, Hajime


Publisher
John Wiley and Sons
Year
2010
Tongue
English
Weight
593 KB
Volume
207
Category
Article
ISSN
0031-8965

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✦ Synopsis


Abstract

The transient surface temperature and optical transmissivity profiles during the plasma annealing of amorphous silicon (a‐Si) on quartz substrate was studied using a radio‐frequency (rf) thermal plasma torch (TPT). The film crystallization promoted through solid‐phase crystallization (SPC) at surface temperature of 750 °C, followed by a lateral crystalline grain growth at above 900 °C within millisecond time domain. The spectroscopic ellipsometry study revealed that the film crystallization by a TPT annealing promoted from near the bottom surface due to the sufficient thermal storage in the bulk rather than the top surface. The average crystalline grain size extended to 200–300 nm by adjusting the stage velocity and substrate distance.


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The microstructure evolution of a hydrogen-implanted Si(111) wafer during annealing was studied using transmission electron microscopy (TEM). In the damaged layer caused by hydrogen implantation before annealing, most defects are platelet-like and are located on (111) planes. A few amorphous clumps