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Reactive wetting of Sn0.7Cu–xZn lead-free solders on Cu substrate

✍ Scribed by Hongqin Wang; Fengjiang Wang; Feng Gao; Xin Ma; Yiyu Qian

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Solderability of Sn-0.7Cu/Si3N4 lead-fre

✍ Mohd Salleh M.A.A; A. M. Mustafa Al Bakri; H. Kamarudin; M. Bnhussain; Zan@Haziz 📂 Article 📅 2011 🏛 Elsevier 🌐 English ⚖ 494 KB

A Comparative Study of Reactive Wetting

✍ Hongqin Wang; Hui Zhao; Dusan P. Sekulic; Yiyu Qian 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 536 KB

Reactive wetting of solders on Cu and Cu

✍ Hongqin Wang; Feng Gao; Xin Ma; Yiyu Qian 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 195 KB

Sn concentration on the reactive wetting

✍ Hongqin Wang; Xin Ma; Feng Gao; Yiyu Qian 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 167 KB

Microstructure and adhesion strength of

✍ Tao-Chih Chang; Shih-Min Chou; Min-Hsiung Hon; Moo-Chin Wang 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 760 KB

Effect of soldering condition on formati

✍ Niwat Mookam; Kannachai Kanlayasiri 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 663 KB