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Solderability of Sn-0.7Cu/Si3N4 lead-free composite solder on Cu-substrate

✍ Scribed by Mohd Salleh M.A.A; A. M. Mustafa Al Bakri; H. Kamarudin; M. Bnhussain; Zan@Hazizi M.H; Flora Somidin

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Mechanical properties of Sn–0.7Cu/Si3N4

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Reactive wetting of Sn0.7Cu–xZn lead-fre

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A Comparative Study of Reactive Wetting

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Evolution of Intermetallic Compounds bet

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