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Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature

✍ Scribed by Li, Mingyu; Li, Zhuolin; Xiao, Yong; Wang, Chunqing

Book ID
127390913
Publisher
American Institute of Physics
Year
2013
Tongue
English
Weight
1022 KB
Volume
102
Category
Article
ISSN
0003-6951

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