✦ LIBER ✦
Formation of AuSnxIMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes
✍ Scribed by Wei Liu, Yanhong Tian, Chunqing Wang, Lining Sun
- Book ID
- 118801608
- Publisher
- Springer US
- Year
- 2012
- Tongue
- English
- Weight
- 948 KB
- Volume
- 24
- Category
- Article
- ISSN
- 0957-4522
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