✦ LIBER ✦

Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications

✍ Scribed by Byunghoon Lee; Jongseo Park; Junghyun Song; Kee-won Kwon; Hoo-jeong Lee

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

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