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Effect of 0.5 wt % Cu in Sn−3.5%Ag Solder Balls on the Solid State Interfacial Reaction with Au/Ni/Cu Bond Pads for Ball Grid Array (BGA) Applications

✍ Scribed by Alam, M. O.; Chan, Y. C.; Tu, K. N.; Kivilahti, J. K.

No coin nor oath required. For personal study only.

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