Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

✍ Scribed by J. Fan, D. F. Lim, L. Peng, K. H. Li, C. S. Tan

• Book ID: 120914862
• Publisher: Springer-Verlag
• Year: 2012
• Tongue: English
• Weight: 460 KB
• Volume: 19
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-012-1689-4