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Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves

โœ Scribed by Li, Zhuolin; Li, Mingyu; Xiao, Yong; Wang, Chunqing


Book ID
122251375
Publisher
Elsevier Science
Year
2014
Tongue
English
Weight
920 KB
Volume
21
Category
Article
ISSN
1350-4177

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