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Property improvement of copper films with zirconium additive for ULSI interconnects

✍ Scribed by Ying Wang; Xiao-dong Yang; Zhong-xiao Song; Yun-tao Liu

Book ID
116605340
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
772 KB
Volume
486
Category
Article
ISSN
0925-8388

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Films of Cu-Ru-Zr and Cu-Zr were deposited on SiO 2 /Si substrates by magnetron sputtering. Samples were subsequently annealed at temperatures of up to 500 Β°C for 1 h and analyzed by four-point probe measurement, X-ray diffraction (XRD), transmission electron microscopy (TEM), X-ray photoelectron sp