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Improved barrier properties of ultrathin Ru film with TaN interlayer for copper metallization

โœ Scribed by Qu, Xin-Ping; Tan, Jing-Jing; Zhou, Mi; Chen, Tao; Xie, Qi; Ru, Guo-Ping; Li, Bing-Zong


Book ID
121284188
Publisher
American Institute of Physics
Year
2006
Tongue
English
Weight
403 KB
Volume
88
Category
Article
ISSN
0003-6951

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Films of Cu-Ru-Zr and Cu-Zr were deposited on SiO 2 /Si substrates by magnetron sputtering. Samples were subsequently annealed at temperatures of up to 500 ยฐC for 1 h and analyzed by four-point probe measurement, X-ray diffraction (XRD), transmission electron microscopy (TEM), X-ray photoelectron sp