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Power semiconductor module using a bonding film with anisotropic thermal conduction

✍ Scribed by Yasushi Yamada

Book ID: 119326714
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 889 KB
Volume: 52
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2012.06.087

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