High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined With Ultrasonic Bonding Technique

✍ Scribed by Kiwon Lee; Saarinen, I.J.; Pykari, L.; Kyung Wook Paik

• Book ID: 117913319
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2011
• Tongue: English
• Weight: 954 KB
• Volume: 1
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2011.2169965