Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

✍ Scribed by Won-Chul Kim; Kiwon Lee; Saarinen, I.J.; Pykari, L.; Kyung-Wook Paik

• Book ID: 117913340
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2012
• Tongue: English
• Weight: 883 KB
• Volume: 2
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2011.2179043