✦ LIBER ✦
Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)
✍ Scribed by Myung Hwan Hong; Sun-Chul Kim; Young-Ho Kim
- Book ID
- 113514163
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 520 KB
- Volume
- 12
- Category
- Article
- ISSN
- 1567-1739
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