Plasma-activated direct bonding of diamond-on-insulator wafers to thermal oxide grown silicon wafers

✍ Scribed by Bayram, Baris; Akar, Orhan; Akin, Tayfun

• Book ID: 122619163
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 586 KB
• Volume: 19
• Category: Article
• ISSN: 0925-9635
• DOI: 10.1016/j.diamond.2010.08.015