Pinhole density measurements of barriers deposited on low-k films

✍ Scribed by D Shamiryan; T Abell; Q.T Le; K Maex

• Book ID: 104305960
• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 163 KB
• Volume: 70
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(03)00375-7

✦ Synopsis

Evaluation of diffusion barrier integrity is an important issue in advanced interconnects. A diffusion barrier separating Cu from low-k must be as thin as possible and must not contain pinholes. We have developed a method for measuring pinhole density in diffusion barriers deposited on low-k materials. The method employs ellipsometric porosimetry for measuring diffusion of toluene in a porous low-k film beneath the barrier in question.