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Photointercalation and Photodeposition of Copper in P-Type Lamellar InSe

✍ Scribed by Levy-Clement, C.

Book ID
118229297
Publisher
The Electrochemical Society
Year
1984
Tongue
English
Weight
564 KB
Volume
131
Category
Article
ISSN
0013-4651

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πŸ“œ SIMILAR VOLUMES

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## Abstract Copper deposition into ordered macroporous silicon prepared in p‐type substrates was investigated by immersion plating and electrochemical deposition in an aqueous solution containing Cu^2+^ ions. When the sample was immersed in 0.1 M CuSO~4~ solution at the open circuit potential, Cu c