Optimization of Thermomechanical Reliability of Board-Level Flip-Chip Packages Implemented With Organic or Silicon Substrates

✍ Scribed by Tong Hong Wang; Yi-Shao Lai

• Book ID: 119816528
• Publisher: IEEE
• Year: 2008
• Tongue: English
• Weight: 1018 KB
• Volume: 31
• Category: Article
• ISSN: 1521-334X
• DOI: 10.1109/tepm.2008.919332