✦ LIBER ✦
Optimal design toward enhancement of thermomechanical reliability of polyimide layers in a flip-chip-on-lead-frame dual flat no-leads package with copper pillar bumps
✍ Scribed by Ning, Wenguo; Zhu, Chunsheng; Li, Heng; Xu, Gaowei; Luo, Le; Guo, Hongyan; Jing, Fei
- Book ID
- 123348162
- Publisher
- Elsevier Science
- Year
- 2013
- Tongue
- English
- Weight
- 887 KB
- Volume
- 16
- Category
- Article
- ISSN
- 1369-8001
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