Optimal chip sizing for multi-chip modules : P. Singh and D. L. Landis. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, 17, 3, 369 (August 1994)

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 114 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(96)81968-8