✦ LIBER ✦
Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D) : Michael E. Scaman, Laertis Economikos and Julius Lambright. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, 17, 3, 291 (August 1994)
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 90 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
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