𝔖 Bobbio Scriptorium

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Minimal IC pretest requirements for multichip modules : Wolfgang Daum and William E. Burdick, Jr, IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, 17, 3, 277 (August 1994)

Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 114 KB
Volume: 36
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(96)81982-2

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