✦ LIBER ✦

On the thermal expansion of CNT/Cu composites for electronic packaging applications

✍ Scribed by Ke Chu, Chengchang Jia

Book ID: 120782724
Publisher: Springer
Year: 2013
Tongue: English
Weight: 503 KB
Volume: 111
Category: Article
ISSN: 1432-0630
DOI: 10.1007/s00339-013-7634-2

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