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Applications of advanced composites for satellite packaging for improved electronic component thermal management

✍ Scribed by John Glatz; D.L. Vrable

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 704 KB
Volume: 29
Category: Article
ISSN: 0094-5765
DOI: 10.1016/0094-5765(93)90057-4

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