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LED Packaging for Lighting Applications (Design, Manufacturing and Testing) || Thermal Management of High Power LED Packaging Module

✍ Scribed by Liu, Sheng; Luo, Xiaobing

Publisher: John Wiley & Sons (Asia) Pte Ltd
Year: 2011
Weight: 387 KB
Category: Article
ISBN: 0470827831
DOI: 10.1002/9780470827857.ch4

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