✦ LIBER ✦
Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
✍ Scribed by C. P. Wong; Raja S. Bollampally
- Publisher
- John Wiley and Sons
- Year
- 1999
- Tongue
- English
- Weight
- 280 KB
- Volume
- 74
- Category
- Article
- ISSN
- 0021-8995
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