𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications

✍ Scribed by Hyo S. Lee; Kyung Y. Jeon; Hee Y. Kim; Soon H. Hong


Book ID
111567932
Publisher
Springer
Year
2000
Tongue
English
Weight
118 KB
Volume
35
Category
Article
ISSN
0022-2461

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES