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Observation of Suppressed Interdiffusion in FeRh/FePt-Ta Bilayer Thin Films

✍ Scribed by Sung-Uk Jang; Eon Byeong Park; Ji-Hong Kim; Ki-Hoon Park; Ji Sung Lee; Young Keun Kim; Seungmin Hyun; Hak-Joo Lee; Soon-Ju Kwon; Hwan-Soo Lee

Book ID
114653842
Publisher
IEEE
Year
2010
Tongue
English
Weight
610 KB
Volume
46
Category
Article
ISSN
0018-9464

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Auger depth profiling technique and X-ray diffraction analysis have been employed to study the interdiffusion in vacuum-deposited copper-nickel bilayer thin films. An adaptation of the Whipple model was used to determine the diffusion coefficients of both nickel in copper and copper in nickel. The c