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Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

✍ Scribed by Iver E. Anderson; Jason W. Walleser; Joel L. Harringa; Fran Laabs; Alfred Kracher

Publisher: Springer US
Year: 2009
Tongue: English
Weight: 683 KB
Volume: 38
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-009-0936-7

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