✦ LIBER ✦

Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

✍ Scribed by B. A. Cook; I. E. Anderson; J. L. Harringa; S. K. Kang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of heat treatment on the electric

✍ B. A. Cook; I. E. Anderson; J. L. Harringa; R. L. Terpstra 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 584 KB

The solid solubility of Ag and Cu in the

✍ L. Snugovsky; C. Cermignani; D. D. Perovic; J. W. Rutter 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 46 KB

Nucleation Control and Thermal Aging Res

✍ Iver E. Anderson; Jason W. Walleser; Joel L. Harringa; Fran Laabs; Alfred Krache 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 683 KB

Aging Characteristics of Sn-Ag Eutectic

✍ M. Ghosh; Abhijit Kar; S. K. Das; A. K. Ray 📂 Article 📅 2009 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 545 KB

Effect of temperature on isothermal low

✍ C Kanchanomai; Y Mutoh 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 670 KB

Copper substrate dissolution in eutectic

✍ S. Chada; R. A. Fournelle; W. Laub; D. Shangguan 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 478 KB