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Novel high performance no flow and reworkable underfills for flip-chip applications

✍ Scribed by C. P. Wong; Lejun Wang; Song-Hua Shi

Book ID: 106248262
Publisher: Maney Publishing
Year: 1999
Tongue: English
Weight: 669 KB
Volume: 2
Category: Article
ISSN: 1432-8917
DOI: 10.1007/s100190050091

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