✦ LIBER ✦
Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials
✍ Scribed by Thorpe, R.; Baldwin, D.F.; Smith, B.; McGovern, L.
- Book ID
- 125464981
- Publisher
- IEEE
- Year
- 2001
- Tongue
- English
- Weight
- 278 KB
- Volume
- 24
- Category
- Article
- ISSN
- 1521-334X
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