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[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

✍ Scribed by Shi, S.H.; Wong, C.P.

Book ID: 126757305
Publisher: IEEE
Year: 1998
Weight: 823 KB
Category: Article
ISBN-13: 9780780345263
DOI: 10.1109/ECTC.1998.678680

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