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[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Characterization of a no-flow underfill encapsulant during the solder reflow process

✍ Scribed by Wong, C.P.; Baldwin, D.; Vincent, M.B.; Fennell, B.; Wang, L.J.; Shi, S.H.

Book ID: 126615174
Publisher: IEEE
Year: 1998
Weight: 786 KB
Category: Article
ISBN-13: 9780780345263
DOI: 10.1109/ECTC.1998.678898

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