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High performance no-flow underfills for low-cost flip-chip applications: material characterization

✍ Scribed by C. Wong; S. Shi; G. Jefferson

Book ID: 126675832
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 223 KB
Volume: 21
Category: Article
ISSN: 1070-9886
DOI: 10.1109/95.725209

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## Abstract No‐flow underfill is used in the assembly of microelectronics to increase the productivity and to decrease the cost of the flip‐chip manufacturing. The curing process, especially the gelation of the no‐flow underfill, is essential for the yield and reliability of the flip‐chip assembly.

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