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Nondestructive bond pull in high reliability applications : Jerome Roddy, Nick Spann and Phil Seese. Proc. IEEE 28th Electron. Components Conf., Anaheim, 24–26 April 1978, p. 300

Publisher: Elsevier Science
Year: 1978
Tongue: English
Weight: 130 KB
Volume: 18
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(78)90803-x

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