𝔖 Bobbio Scriptorium

✦ LIBER ✦

The optimization of lead frame bond parameters for production of reliable thermocompression bonds : R. J. Blazek and W. A. Piper. Proc. IEEE 28th Electron. Components Conf., Anaheim, 24–26 April 1978, p. 373

Publisher: Elsevier Science
Year: 1978
Tongue: English
Weight: 130 KB
Volume: 18
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(78)90806-5

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Lead forming and outer lead bond pattern

Lead forming and outer lead bond pattern design of tape bonded hybrids : William R. Rodrigues de Miranda, Rudolph G. Oswald and Don Brown. Proc. IEEE 28th Electron. Components Conf., Anaheim, 24–26 April 1978, p. 159

📂 Article 📅 1978 🏛 Elsevier Science 🌐 English ⚖ 234 KB

High-density high-reliability multichip

High-density high-reliability multichip hybrid packaging with thin films and beam leads : W. J. Greig, P. J. Moneika and R. A. Brown. Proc. IEEE 28th Electron. Components Conf., Anaheim, 24–26 April 1978, p. 146

📂 Article 📅 1978 🏛 Elsevier Science 🌐 English ⚖ 128 KB