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High-density high-reliability multichip hybrid packaging with thin films and beam leads : W. J. Greig, P. J. Moneika and R. A. Brown. Proc. IEEE 28th Electron. Components Conf., Anaheim, 24–26 April 1978, p. 146


Publisher
Elsevier Science
Year
1978
Tongue
English
Weight
128 KB
Volume
18
Category
Article
ISSN
0026-2714

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