The microelectronic wire bond pull test—How to use it, how to abuse it : G. G. Harman and C. A. Cannon. Proc. IEEE 28th Electron. Components Conf., Anaheim, 24–26 April 1978, p. 291

• Publisher: Elsevier Science
• Year: 1978
• Tongue: English
• Weight: 123 KB
• Volume: 18
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(78)90817-x